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MAM
2006

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A high throughput 3D-bus interconnect for network processors

13 years 4 months ago

A high throughput 3D-bus interconnect for network processors

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Deep layer processing and increasing line rates present a memory challenge to processor

Taskin Koçak, Jacob Engel

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Deep Layer Processing | Line Card | MAM 2006 | Memory Bandwidth |

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Added	14 Dec 2010
Updated	14 Dec 2010
Type	Journal
Year	2006
Where	MAM
Authors	Taskin Koçak, Jacob Engel

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