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2008
ACM

Keeping hot chips cool: are IC thermal problems hot air?

8 years 4 months ago
Keeping hot chips cool: are IC thermal problems hot air?
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart process design, die design and software optimization. Paul Franzon: The "niche" in which detailed thermal design matters grows with technology scaling. A key decision is Copyright is held by the author/owner(s). DAC 2008, June 8
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J
Added 19 Oct 2010
Updated 19 Oct 2010
Type Conference
Year 2008
Where DAC
Authors Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J. Weger, Paul Franzon, Andrew Yang, Stephen V. Kosonocky
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