Keeping hot chips cool: are IC thermal problems hot air?

level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart process design, die design and software optimization. Paul Franzon: The "niche" in which detailed thermal design matters grows with technology scaling. A key decision is Copyright is held by the author/owner(s). DAC 2008, June 8

• Type: Conference
• Year: 2008
• Where: DAC
• Authors: Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J. Weger, Paul Franzon, Andrew Yang, Stephen V. Kosonocky
• Keywords: Computer Architecture, Copyright 2008 Acm, DAC 2008, Robust Thermal Design, Thermal Design