DAC
2008
ACM
13 years 6 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
DAC
2004
ACM
14 years 5 months ago
2004
ACM
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propo...