Sciweavers

Share
DAC
2008
ACM
9 years 5 months ago
Keeping hot chips cool: are IC thermal problems hot air?
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J...
DAC
2004
ACM
10 years 4 months ago
Compact thermal modeling for temperature-aware design
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propo...
Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik ...
books