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DAC
2008
ACM

Many-core design from a thermal perspective

9 years 3 months ago
Many-core design from a thermal perspective
Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of cores, but also creates new opportunities for temperature-aware design, because multi-core designs offer more design parameters than single-core designs. This paper investigates the relationship between core size and on-chip hot spot temperature and shows that with the same power density, smaller cores are cooler than larger cores due to a spatial low-pass filtering effect of temperature. This phenomenon suggests that designs exploiting low-pass filtering can dissipate more power within the same cooling budget than contemporary designs. Categories and Subject Descriptors B.7.2 Hardware [Design Aids]: General Terms Design Keywords temperature, many-core design, thermal design power, performance
Wei Huang, Mircea R. Stan, Karthik Sankaranarayana
Added 12 Nov 2009
Updated 12 Nov 2009
Type Conference
Year 2008
Where DAC
Authors Wei Huang, Mircea R. Stan, Karthik Sankaranarayanan, Robert J. Ribando, Kevin Skadron
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