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2008

Metal-Density-Driven Placement for CMP Variation and Routability

8 years 11 months ago
Metal-Density-Driven Placement for CMP Variation and Routability
In this paper, we propose the first metal-density driven placement algorithm to reduce CMP variation and achieve higher routability. Based on an analytical placement framework, we use a probabilistic routing model to estimate the wire density during the placement. Then, the metal density and thickness are predicted by a predictive CMP model. The spreading forces are adjusted according to the metal density map to reduce the metal density variation. Experimental results show that our method reduces the topography variation by 12% and the number of dummy fills by 6% and achieves much better routability, compared with wirelengthdriven placement. Categories and Subject Descriptors: B.7.2 [Integrated Circuits]: Design Aids General Terms: Algorithms, Design, Performance
Tung-Chieh Chen, Minsik Cho, David Z. Pan, Yao-Wen
Added 15 Dec 2010
Updated 15 Dec 2010
Type Journal
Year 2008
Where TCAD
Authors Tung-Chieh Chen, Minsik Cho, David Z. Pan, Yao-Wen Chang
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