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ICRA
1998
IEEE

Parallel Microassembly with Electrostatic Force Fields

9 years 7 months ago
Parallel Microassembly with Electrostatic Force Fields
Assembly is a fundamental issue in the volume production of products that include microscopic submillimeter parts. These parts are often fabricated in parallel at high density but must then be assembled into patterns with lower spatial density. In this paper we propose a new approach to microassembly using 1 ultrasonic vibration to eliminate friction and adhesion, and 2 electrostatic forces to position and align parts in parallel. We describe experiments on the dynamic and frictional properties of collections of microscopic parts under these conditions. We rst demonstrate that ultrasonic vibration can be used to overcome adhesive forces; we also compare part behavior in air and vacuum. Next, we demonstrate that parts can be positioned and aligned using a combination of vibration and electrostatic forces. Finally, we demonstrate part sorting by size. Motivated by these feasibility experiments, our goal is a systematic method for designing implementable planar force elds for microassemb...
Karl-Friedrich Böhringer, Kenneth Y. Goldberg
Added 04 Aug 2010
Updated 04 Aug 2010
Type Conference
Year 1998
Where ICRA
Authors Karl-Friedrich Böhringer, Kenneth Y. Goldberg, Michael Cohn, Roger Howe, Al Pisano
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