| Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs Recent countries visiting this post |  |
 | 7 | United States |
 | 1 | Japan |
| Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs Recent countries visiting this post | |
| 7 | United States |
| 1 | Japan |