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ISQED
2008
IEEE

Process Variation Characterization and Modeling of Nanoparticle Interconnects for Foldable Electronics

13 years 10 months ago
Process Variation Characterization and Modeling of Nanoparticle Interconnects for Foldable Electronics
— Designers require variational information for robust designs. Characterization of such information can be costly for the novel nanoparticle interconnect process, which utilize nanoparticle silver solutions. To reduce characterization cost and initiate circuit level considerations for foldable electronics, we provide nanoparticle interconnect models. We use SEM measurements to characterize nanoparticle size distribution. We conduct field solver simulations over the proposed model to obtain physics-based process variation impact on a nanoparticle interconnect resistance. Such methodology can be helpful to aid designers for circuits based on novel transistors, such as organic TFTs on low cost foldable substrates.
Rasit Onur Topaloglu
Added 31 May 2010
Updated 31 May 2010
Type Conference
Year 2008
Where ISQED
Authors Rasit Onur Topaloglu
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