3 search results - page 1 / 1 » 3D thermal-ADI: an efficient chip-level transient thermal si... |
TCAD
2002
13 years 4 months ago
2002
Abstract--Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three
ISPD
2003
ACM
13 years 10 months ago
2003
ACM
ICCD
2005
IEEE
13 years 10 months ago
2005
IEEE
As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...