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DATE
2010
IEEE
156views Hardware» more  DATE 2010»
13 years 10 months ago
3D-integration of silicon devices: A key technology for sophisticated products
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
Armin Klumpp, Peter Ramm, R. Wieland
CORR
2008
Springer
148views Education» more  CORR 2008»
13 years 5 months ago
Copper Electrodeposition for 3D Integration
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
Rozalia Beica, Charles Sharbono, Tom Ritzdorf
VLSID
2006
IEEE
183views VLSI» more  VLSID 2006»
13 years 11 months ago
Design Challenges for High Performance Nano-Technology
This tutorial present the key aspects of design challenges and its solutions that are being experienced in VLSI design in the era of nano technology. The focus will be on design c...
Goutam Debnath, Paul J. Thadikaran
GI
2009
Springer
13 years 9 months ago
Barcode Application Innovation for Smartphones
: Modern smartphones provide a high sophisticated camera and a high resolution display. Therefore, they can be used to enable various application scenarios for 1D and 2D barcode re...
Gerald Eichler, Karl-Heinz Lüke, Aykan Aydin,...