13 search results - page 1 / 3 » 3dic 2009 |
DAC
2009
ACM
13 years 9 months ago
2009
ACM
This work discusses a 1024-point, memory-on-logic 3DIC FFT processor for synthetic aperture radar (SAR), sent to
3DIC
2009
IEEE
13 years 12 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
3DIC
2009
IEEE
13 years 12 months ago
2009
IEEE
3DIC
2009
IEEE
13 years 12 months ago
2009
IEEE
—A high-sensitivity capacitive-coupling interface is presented for wireless wafer testing systems. The transmitter is a buffer that drives the transmitter pad, and the receiver c...
3DIC
2009
IEEE
13 years 10 months ago
2009
IEEE
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the Hard disk drives (HDD). Recent trends show that the solid s...