Inter-wire coupling is a major source of power consumption and delay faults for on-chip buses implemented in UDSM SoC Systems. Elimination or minimization of such faults is crucia...
Inductance effects of on-chip interconnects have become more and more significant in today’s high-speed digital circuits, especially for global interconnects such as signal buse...
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
In this paper, we propose joint repeater insertion and crosstalk avoidance coding as a low-power alternative to repeater insertion for global bus design in nanometer technologies....
—The dynamic programmable logic array (PLA) style has become popular in designing high-performance microprocessors because of its high speed and predictable routing delay. Howeve...