34 search results - page 1 / 7 » A Case Study of Communication Optimizations on 3D Mesh Inter... |
EUROPAR
2009
Springer
13 years 11 months ago
2009
Springer
Optimal network performance is critical to efficient parallel scaling for communication-bound applications on large machines. With wormhole routing, no-load latencies do not increa...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
GLVLSI
2009
IEEE
13 years 2 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
COMPUTING
2008
13 years 5 months ago
2008
Generalizing the approach of a previous work [15] the authors present multilevel preconditioners for three-dimensional (3D) elliptic problems discretized by a family of Rannacher ...