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VTS
1999
IEEE
66views Hardware» more  VTS 1999»
13 years 9 months ago
A New Bare Die Test Methodology
1 While multichip module technology has been developed for high performance IC applications, the technology is not widely adopted due to economical reasons. One of the reasons that...
Zao Yang, K.-T. Cheng, K. L. Tai
ITC
1997
IEEE
60views Hardware» more  ITC 1997»
13 years 9 months ago
Current Signatures: Application
Analysis of IC technology trends indicates that Iddq testing may be approaching its limits of applicability. The new concept of the current signature may expand this limit under t...
Anne E. Gattiker, Wojciech Maly