— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
The structural redundancy inherent to on-chip interconnection networks [networks on chip (NoC)] can be exploited by adaptive routing algorithms in order to provide connectivity eve...
Flow control mechanisms in Network-on-Chip (NoC) architectures are critical for fast packet propagation across the network and for low idling of network resources. Buffer manageme...
Antonio Pullini, Federico Angiolini, Davide Bertoz...
Chip multiprocessors (CMPs) are expected to be the building blocks for future computer systems. While architecting these emerging CMPs is a challenging problem on its own, program...
Ozcan Ozturk, Mahmut T. Kandemir, Mary Jane Irwin,...