24 search results - page 2 / 5 » A low-radix and low-diameter 3D interconnection network desi... |
HPCA
2009
IEEE
14 years 5 months ago
2009
IEEE
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
3DIC
2009
IEEE
14 years 3 days ago
2009
IEEE
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
CONEXT
2009
ACM
13 years 6 months ago
2009
ACM
Shipping-container-based data centers have been introduced as building blocks for constructing mega-data centers. However, it is a challenge on how to interconnect those container...