24 search results - page 3 / 5 » A low-radix and low-diameter 3D interconnection network desi... |
DATE
2009
IEEE
14 years 15 days ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
NOCS
2009
IEEE
14 years 14 days ago
2009
IEEE
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...
ASPDAC
2009
ACM
14 years 8 days ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
ISCA
2006
IEEE
13 years 11 months ago
2006
IEEE
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
ICCAD
2008
IEEE
14 years 2 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...