1017 search results - page 1 / 204 » A routing algorithm for flip-chip design |
DAC
2007
ACM
14 years 5 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
The flip-chip package is introduced for modern IC designs with higher integration density and larger I/O counts. In this paper, we consider the pre-assignment flip-chip routing pr...
ISPD
1999
ACM
13 years 9 months ago
1999
ACM
—Maze routing algorithms are widely used for finding an optimal path in detailed routing for very large scale integration, printed circuit board and multichip modules In this pap...
TCAD
2010
12 years 11 months ago
2010
In recent years, structured application-specific integrated circuit (ASIC) design style has lessened the importance of mask cost. Multiple structured ASIC chip designs share the sa...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...