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ISQED
2003
IEEE
104views Hardware» more  ISQED 2003»
13 years 11 months ago
A CAD-Oriented Modeling Approach of Frequency-Dependent Behavior of Substrate Noise Coupling for Mixed-Signal IC Design
A simple, efficient CAD-oriented equivalent circuit modeling approach of frequency-dependent behavior of substrate noise coupling is presented. It is shown that the substrate exhi...
Hai Lan, Zhiping Yu, Robert W. Dutton
DAC
1996
ACM
13 years 9 months ago
Use of Sensitivities and Generalized Substrate Models in Mixed-Signal IC Design
A novel methodology for circuit design and automatic layout generation is proposed for a class of mixed-signal circuits in presence of layout parasitics and substrate induced nois...
Paolo Miliozzi, Iasson Vassiliou, Edoardo Charbon,...
ICCAD
1999
IEEE
62views Hardware» more  ICCAD 1999»
13 years 10 months ago
A scalable substrate noise coupling model for mixed-signal ICs
A scalable macromodel for substrate noise coupling in heavily doped substrates has been developed. This model is simple since it requires only four parameters which can readily be ...
Anil Samavedam, Kartikeya Mayaram, Terri S. Fiez
DAC
2003
ACM
13 years 11 months ago
4G terminals: how are we going to design them?
Fourth-generation wireless communication systems (4G) will have totally different requirements than what front-end designers have been coping with up to now. Designs must be targe...
Jan Craninckx, Stéphane Donnay
TVLSI
2002
144views more  TVLSI 2002»
13 years 5 months ago
On-chip inductance cons and pros
Abstract--This paper provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and nondesirable effects. Among the u...
Yehea I. Ismail