6 search results - page 1 / 2 » Adaptive admittance-based conductor meshing for interconnect... |
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
ICCAD
2001
IEEE
14 years 1 months ago
2001
IEEE
Interconnect structures including dielectrics can be modeled by an integral equation method using volume currents and surface charges for the conductors, and volume polarization c...
DAC
1998
ACM
14 years 5 months ago
1998
ACM
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
MASCOTS
2004
13 years 6 months ago
2004
Several models of deterministic routing have been proposed for wormhole-routed mesh networks while there is only one model, to our best knowledge, proposed for fully adaptive worm...
TPDS
1998
13 years 4 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...