31 search results - page 2 / 7 » Adaptive chip-package thermal analysis for synthesis and des... |
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
AAAI
1998
13 years 6 months ago
1998
Manyimportant physical phenomena,such as temperature distribution, air flow, and acoustic waves,are describedas continuous,distributed parameterfields. Analyzingandcontrolling the...
FPL
2007
Springer
13 years 11 months ago
2007
Springer
Today’s heterogeneous embedded systems combine components from different domains, such as software, analogue hardware and digital hardware. The design and implementation of thes...
AROBOTS
2008
13 years 5 months ago
2008
Object grasping is a typical human ability which is widely studied from both a biological and an engineering point of view. This paper presents an approach to grasp synthesis inspi...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Power and performance benefits of scaling are lost to worst case margins as uncertainty of device characteristics is increasing. Adaptive techniques can dynamically adjust the mar...