24 search results - page 1 / 5 » Adaptive multi-domain thermal modeling and analysis for inte... |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
ASPDAC
2006
ACM
13 years 8 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...