Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
Abstract— In this paper, we address the problem of determining the relative position and orientation (pose) of two robots navigating in 2D, based on known egomotion and noisy rob...
We consider a pair of nodes with stochastic traffic flows who wish to communicate in a bi-directional communication scenario using intermediate relays in two-hop fashion. Intermed...
This paper presents an algorithm for computing optical flow, shape, motion, lighting, and albedo from an image sequence of a rigidly-moving Lambertian object under distant illumin...
Li Zhang, Brian Curless, Aaron Hertzmann, Steven M...