3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
—While computing speed continues increasing rapidly, data-access technology is lagging behind. Data-access delay, not the processor speed, becomes the leading performance bottlen...
On-chip interconnection networks (OCINs) have emerged as a modular and scalable solution for wire delay constraints in deep submicron VLSI design. OCIN research has shown that the ...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri
Adaptively adjusting transmission rate and power to concurrently enhance goodput and save energy is an important issue in the wireless local area network (WLAN). However, goodput ...
As the performance gap between processors and memory systems increases, the CPU spends more time stalled waiting for data from main memory. Critical long latency instructions, suc...
Nikil Mehta, Brian Singer, R. Iris Bahar, Michael ...