28 search results - page 5 / 6 » An Enhanced Multilevel Algorithm for Circuit Placement |
ICCAD
2005
IEEE
14 years 2 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
ICCAD
2003
IEEE
2003
IEEE
Multi.Objective Hypergraph Partitioning Algorithms for Cut and Maximum Subdomain Degree Minimization
14 years 2 months ago
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...
TCAD
2008
13 years 5 months ago
2008
The relatively poor scaling of interconnect in modern digital circuits necessitates a number of design optimizations, which must typically be iterated several times to meet the spe...
ISQED
2005
IEEE
13 years 11 months ago
2005
IEEE
Due to the rapid development of manufacturing process technology and tight marketing schedule, the chip design and manufacturing always work toward an integrated solution to achie...
DAC
1996
ACM
13 years 10 months ago
1996
ACM
Abstract -- This paper presents a novel, Boolean approach to LUTbased FPGA technology mapping targeting high performance. As the core of the approach, we have developed a powerful ...