22 search results - page 3 / 5 » An accurate interconnect thermal model using equivalent tran... |
GLVLSI
2002
IEEE
13 years 10 months ago
2002
IEEE
— The high-order compact finite difference (HCFD) method is adapted for interconnect modeling. Based on the compact finite difference method, the HCFD method employs the Chebys...
ICCAD
2004
IEEE
14 years 2 months ago
2004
IEEE
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
VLSID
2000
IEEE
13 years 9 months ago
2000
IEEE
The test signal method can be used to measure and model inductance parameters (self and mutual) of a very small interconnect especially in highdensity IC’s by using a test signa...
ISCA
2003
IEEE
13 years 10 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
In this paper, we propose a new model order reduction approach for large interconnect circuits using hierarchical decomposition and Krylov subspace projection-based model order re...