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TCAD
2008
114views more  TCAD 2008»
13 years 4 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
DAC
2004
ACM
14 years 5 months ago
An integrated hardware/software approach for run-time scratchpad management
An ever increasing number of dynamic interactive applications are implemented on portable consumer electronics. Designers depend largely on operating systems to map these applicat...
Francesco Poletti, Paul Marchal, David Atienza, Lu...
FPL
2005
Springer
131views Hardware» more  FPL 2005»
13 years 10 months ago
An Efficient Approach to Hide the Run-Time Reconfiguration from SW Applications
Dynamically reconfigurable logic is becoming an important design unit in SoC system. A method to make the reconfiguration management transparent to software applications is requir...
Yang Qu, Juha-Pekka Soininen, Jari Nurmi
SCOPES
2007
Springer
13 years 10 months ago
Operating system integrated energy aware scratchpad allocation strategies for multiprocess applications
Various scratchpad allocation strategies have been developed in the past. Most of them target the reduction of energy consumption. These approaches share the necessity of having d...
Robert Pyka, Christoph Faßbach, Manish Verma...
ICCAD
2008
IEEE
153views Hardware» more  ICCAD 2008»
14 years 1 months ago
SPM management using Markov chain based data access prediction
— Leveraging the power of scratchpad memories (SPMs) available in most embedded systems today is crucial to extract maximum performance from application programs. While regular a...
Taylan Yemliha, Shekhar Srikantaiah, Mahmut T. Kan...