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» Architectural evaluation of 3D stacked RRAM caches
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ISCA
2009
IEEE
189views Hardware» more  ISCA 2009»
13 years 11 months ago
Hybrid cache architecture with disparate memory technologies
Caching techniques have been an efficient mechanism for mitigating the effects of the processor-memory speed gap. Traditional multi-level SRAM-based cache hierarchies, especially...
Xiaoxia Wu, Jian Li, Lixin Zhang, Evan Speight, Ra...
CF
2008
ACM
13 years 6 months ago
A modular 3d processor for flexible product design and technology migration
The current methodology used in mass-market processor design is to create a single base microarchitecture (e.g., Intel's "Core"or AMD's"K8") that is ...
Gabriel H. Loh
ICCAD
2007
IEEE
157views Hardware» more  ICCAD 2007»
14 years 1 months ago
Performance and power evaluation of a 3D CMOS/nanomaterial reconfigurable architecture
—In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The propos...
Chen Dong, Deming Chen, Sansiri Tanachutiwat, Wei ...
ISCA
2006
IEEE
162views Hardware» more  ISCA 2006»
13 years 11 months ago
Design and Management of 3D Chip Multiprocessors Using Network-in-Memory
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
Feihui Li, Chrysostomos Nicopoulos, Thomas D. Rich...
ICPP
2007
IEEE
13 years 11 months ago
Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Hiroki Matsutani, Michihiro Koibuchi, Hideharu Ama...