8 search results - page 2 / 2 » Area optimization for leakage reduction and thermal stabilit... |
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
Power dissipation is quickly becoming one of the most important limiters in nanometer IC design for leakage increases exponentially as the technology scaling down. However, power ...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
DAC
2000
ACM
14 years 6 months ago
2000
ACM
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...