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ICCAD
2002
IEEE
113views Hardware» more  ICCAD 2002»
14 years 2 months ago
Interconnect-aware high-level synthesis for low power
Abstract—Interconnects (wires, buffers, clock distribution networks, multiplexers and busses) consume a significant fraction of total circuit power. In this work, we demonstrat...
Lin Zhong, Niraj K. Jha
DAC
2003
ACM
14 years 6 months ago
Multilevel global placement with retiming
Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous designs, this requires retiming and pipel...
Jason Cong, Xin Yuan
ISCA
2008
IEEE
188views Hardware» more  ISCA 2008»
13 years 11 months ago
MIRA: A Multi-layered On-Chip Interconnect Router Architecture
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
Dongkook Park, Soumya Eachempati, Reetuparna Das, ...
ISQED
2006
IEEE
107views Hardware» more  ISQED 2006»
13 years 11 months ago
On Optimizing Scan Testing Power and Routing Cost in Scan Chain Design
— With advanced VLSI manufacturing technology in deep submicron (DSM) regime, we can integrate entire electronic systems on a single chip (SoC). Due to the complexity in SoC desi...
Li-Chung Hsu, Hung-Ming Chen
ISCA
2010
IEEE
305views Hardware» more  ISCA 2010»
13 years 10 months ago
Rethinking DRAM design and organization for energy-constrained multi-cores
DRAM vendors have traditionally optimized the cost-perbit metric, often making design decisions that incur energy penalties. A prime example is the overfetch feature in DRAM, wher...
Aniruddha N. Udipi, Naveen Muralimanohar, Niladris...