Novel reconfigurable computing architectures exploit the inherent parallelism available in many signalprocessing problems. These architectures often consist of networks of compute...
Continuous evolution in process technology brings energyefficiency and reliability challenges, which are harder for memory system designs since chip multiprocessors demand high ba...
Jung Ho Ahn, Norman P. Jouppi, Christos Kozyrakis,...
Significant improvement to visual quality for real-time 3D graphics requires modeling of complex illumination effects like soft-shadows, reflections, and diffuse lighting intera...
Venkatraman Govindaraju, Peter Djeu, Karthikeyan S...
As embedded computing evolves towards ever more powerful architectures, the challenge of properly interconnecting large numbers of on-chip computation blocks is becoming prominent...
Antonio Pullini, Federico Angiolini, Paolo Meloni,...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...