—This paper addresses the problem of chip level thermal profile estimation using runtime temperature sensor readings. We address the challenges of a) availability of only a few t...
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci...
Next generation industrial embedded platforms require the development of complex power and thermal management solutions. Indeed, an increasingly fine and intrusive thermal contro...
Andrea Acquaviva, Andrea Calimera, Alberto Macii, ...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....