With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
David Atienza, Pablo Garcia Del Valle, Giacomo Pac...
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
Compute clusters are consuming more power at higher densities than ever before. This results in increased thermal dissipation, the need for powerful cooling systems, and ultimatel...
Kirk W. Cameron, Hari K. Pyla, Srinidhi Varadaraja...
Many DTM schemes rely heavily on the accurate knowledge of the chip's dynamic thermal state to make optimal performance/ temperature trade-off decisions. This information is ...