14 search results - page 2 / 3 » Compact modelling of Through-Silicon Vias (TSVs) in three-di... |
GLVLSI
2009
IEEE
13 years 2 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
GLVLSI
2009
IEEE
13 years 11 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption...