14 search results - page 3 / 3 » Compact modelling of Through-Silicon Vias (TSVs) in three-di... |
ISPD
2011
ACM
12 years 7 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
DAC
2010
ACM
13 years 8 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
ICCAD
2004
IEEE
14 years 1 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
ASAP
2011
IEEE
12 years 4 months ago
2011
IEEE
—The domain of vision and navigation often includes applications for feature tracking as well as simultaneous localization and mapping (SLAM). As these problems require computati...