17 search results - page 1 / 4 » Cost of Silicon Viewed from VLSI Design Perspective |
DAC
1994
ACM
13 years 8 months ago
1994
ACM
- This paper provides an overview of design/test/CAD silicon cost-related issues. All major factors contributing to the rapid growth of manufacturing costs are explained and a simp...
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
As a result of aggressive technology scaling, gate leakage (gate oxide direct tunneling) has become a major component of total power dissipation. Use of dielectrics of higher perm...
ISVLSI
2008
IEEE
13 years 11 months ago
2008
IEEE
With the advent of nanometer technologies, the design size of integrated circuits is getting larger and the operation speed is getting faster. As a consequence, test cost is becom...
GLVLSI
2003
IEEE
13 years 9 months ago
2003
IEEE
Concerned by the wall that Moore’s Law is expected to hit in the next decade, the integrated circuit community is turning to emerging nanotechnologies for continued device impro...
ICCAD
2008
IEEE
14 years 1 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...