Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...
Many intellectual property protection (IPP) techniques have been proposed. Their primary objectives are providing convincible proof of authorship with least degradation of the qua...
Modern storage systems use thousands of inexpensive disks to meet the storage requirement of applications. To enhance the data availability, some form of redundancy is used. For e...
Liping Xiang, Yinlong Xu, John C. S. Lui, Qian Cha...
Cache partitioning and sharing is critical to the effective utilization of multicore processors. However, almost all existing studies have been evaluated by simulation that often ...