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ICCAD
2007
IEEE

3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits

10 years 11 months ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized during 3D floorplanning, significantly increasing optimization complexity. Most existing floorplanners use combinatorial stochastic optimization techniques, hampering performance and scalability when used for 3D floorplanning. In this work, we propose and evaluate a scalable, temperature-aware, force-directed floorplanner called 3D-STAF. Force-directed techniques, although efficient at reacting to physical information such as temperature gradients, must eventually eliminate overlap. This can cause significant displacement when used for heterogeneous blocks. To smooth the transition from an unconstrained 3D placement to a legalized, layer-assigned floorplan, we propose a three-stage force-directed optimization flow combined with new legalization techniques that eliminate white spaces and block overlappi...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P.
Added 16 Mar 2010
Updated 16 Mar 2010
Type Conference
Year 2007
Where ICCAD
Authors Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. Dick, Li Shang, Hai Zhou, Xianlong Hong, Qiang Zhou
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