150 search results - page 30 / 30 » Design and CAD for 3D integrated circuits |
DAC
2010
ACM
13 years 8 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
DAC
2002
ACM
14 years 5 months ago
2002
ACM
Increasing non-recurring engineering (NRE) and mask costs are making it harder to turn to hardwired Application Specific Integrated Circuit (ASIC) solutions for high performance a...
DAC
2003
ACM
14 years 5 months ago
2003
ACM
Skin effect makes interconnect resistance and inductance frequency dependent. This paper addresses the problem of efficiently estimating the signal characteristics of any RLC netw...
ISPD
2005
ACM
13 years 10 months ago
2005
ACM
In the nanometer VLSI technology, the variation effects like manufacturing variation, power supply noise, temperature etc. become very significant. As one of the most vital nets...
ICCAD
2003
IEEE
2003
IEEE
Multi.Objective Hypergraph Partitioning Algorithms for Cut and Maximum Subdomain Degree Minimization
14 years 1 months ago
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...