3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
One of the major differences in partitioning for codesign is in the way the communication cost is evaluated. Generally the size of the edge cut-set is used. When communication bet...
Latency-insensitive protocols allow system-on-chip (SoC) engineers to decouple the design of the computing cores from the design of the intercore communication channels while follo...
Distributed weighted fair scheduling schemes for QoS support in wireless networks have not yet become standard. In this paper we propose an Admission Control and Dynamic Bandwidth...
As companies move towards many-core chips, an efficient onchip communication fabric to connect these cores assumes critical importance. To address limitations to wire delay scala...