— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Abstract. With more cores integrated into one single chip, the overall power consumption from the multiple concurrent running programs increases dramatically in a CMP processor whi...
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...
Francesco Zanini, David Atienza, Giovanni De Miche...