76 search results - page 1 / 16 » Dynamic thermal management in 3D multicore architectures |
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
ICCAD
2010
IEEE
13 years 2 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
DAC
2008
ACM
14 years 5 months ago
2008
ACM
Recently, processor power density has been increasing at an alarming rate resulting in high on-chip temperature. Higher temperature increases current leakage and causes poor relia...
ISCA
2006
IEEE
13 years 4 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...