76 search results - page 3 / 16 » Dynamic thermal management in 3D multicore architectures |
ISLPED
2009
ACM
13 years 10 months ago
2009
ACM
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors that run multi-threaded workloads. We introduce a new predictor that utilizes the ...
APPT
2009
Springer
14 years 7 days ago
2009
Springer
Abstract. With more cores integrated into one single chip, the overall power consumption from the multiple concurrent running programs increases dramatically in a CMP processor whi...
GLVLSI
2009
IEEE
13 years 9 months ago
2009
IEEE
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
MICRO
1999
IEEE
13 years 10 months ago
1999
IEEE
Although PC-class 3D graphics hardware has made significant strides in the last several years, the underlying architectural design principles are still generally considered as a b...