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TCAD
2008
114views more  TCAD 2008»
13 years 6 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
DFT
2006
IEEE
105views VLSI» more  DFT 2006»
14 years 3 days ago
Thermal-Aware SoC Test Scheduling with Test Set Partitioning and Interleaving
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...
Zhiyuan He, Zebo Peng, Petru Eles, Paul M. Rosinge...
AVI
2008
13 years 8 months ago
Agent warp engine: formula based shape warping for networked applications
Computer visualization and networking have advanced dramatically over the last few years, partially driven by the exploding video game market. 3D hardware acceleration has reached...
Alexander Repenning, Andri Ioannidou
COMCOM
2006
121views more  COMCOM 2006»
13 years 6 months ago
Load-balanced agent activation for value-added network services
In relation to its growth in size and user population, the Internet faces new challenges that have triggered the proposals of value-added network services, e.g., IP multicast, IP ...
Chao Gong, Kamil Saraç, Ovidiu Daescu, Bala...
BMCBI
2005
246views more  BMCBI 2005»
13 years 6 months ago
ParPEST: a pipeline for EST data analysis based on parallel computing
Background: Expressed Sequence Tags (ESTs) are short and error-prone DNA sequences generated from the 5' and 3' ends of randomly selected cDNA clones. They provide an im...
Nunzio D'Agostino, Mario Aversano, Maria Luisa Chi...