Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...
Zhiyuan He, Zebo Peng, Petru Eles, Paul M. Rosinge...
Computer visualization and networking have advanced dramatically over the last few years, partially driven by the exploding video game market. 3D hardware acceleration has reached...
In relation to its growth in size and user population, the Internet faces new challenges that have triggered the proposals of value-added network services, e.g., IP multicast, IP ...
Background: Expressed Sequence Tags (ESTs) are short and error-prone DNA sequences generated from the 5' and 3' ends of randomly selected cDNA clones. They provide an im...
Nunzio D'Agostino, Mario Aversano, Maria Luisa Chi...