Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
We apply a scalable approach for practical, comprehensive design space evaluation and optimization. This approach combines design space sampling and statistical inference to ident...
This paper presents a new approach towards parallel I/O for message-passing (MPI) applications on clusters built with commodity hardware and an SCI interconnect: instead of using t...
We present a new data partitioning strategy for parallel computing on three interconnected clusters. This partitioning has two advantages over existing partitionings. First it can...