As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...
Hang Li, Pu Liu, Zhenyu Qi, Lingling Jin, Wei Wu, ...
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
High Performance Computing data centers have been rapidly growing, both in number and size. Thermal management of data centers can address dominant problems associated with cooling...
Qinghui Tang, Sandeep K. S. Gupta, Georgios Varsam...