14 search results - page 1 / 3 » Electrical modeling and characterization of 3-D vias |
10
Voted
ISCAS
2008
IEEE
13 years 11 months ago
2008
IEEE
Abstract— Electrical characterization of the resistance, capacitance, and inductance of inter-plane 3-D vias is presented in this paper. Both capacitive and inductive coupling be...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
MICCAI
2000
Springer
13 years 8 months ago
2000
Springer
This paper presents a deformable model for automatically segmenting objects from volumetric MR images and obtaining point correspondences, using geometric and statistical informati...
IPMI
2001
Springer
14 years 5 months ago
2001
Springer
This paper presents a Bayesian multi-scale three dimensional deformable template approach based on a medial representation for the segmentation and shape characterization of anatom...
MICCAI
2008
Springer
14 years 6 months ago
2008
Springer
In this paper we present a fully automated approach to the segmentation of pediatric brain tumors in multi-spectral 3-D magnetic resonance images. It is a top-down segmentation app...