116 search results - page 1 / 24 » Electromigration-Aware Physical Design of Integrated Circuit... |
VLSID
2005
IEEE
14 years 5 months ago
2005
IEEE
The electromigration effect within current-density-stressed signal and power lines is an ubiquitous and increasingly important reliability and design problem in sub-micron IC desi...
ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ASPDAC
2011
ACM
12 years 9 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ISQED
2000
IEEE
2000
IEEE
A Layout Approach for Electrical and Physical Design Integration of High-Performance Analog Circuits
13 years 9 months ago
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...
INTEGRATION
2008
13 years 5 months ago
2008
Physical synthesis is a relatively young field in Electronic Design Automation. Many published optimizations for physical synthesis end up hurting the quality of the final design,...