10 search results - page 1 / 2 » Exploiting Microarchitectural Redundancy For Defect Toleranc... |
ICCD
2003
IEEE
14 years 1 months ago
2003
IEEE
Continued advancements in fabrication technology and reductions in feature size create challenges in maintaining both manufacturing yield rates and long-term reliability of device...
ISCA
2005
IEEE
13 years 10 months ago
2005
IEEE
Scaling feature size improves processor performance but increases each device’s susceptibility to defects (i.e., hard errors). As a result, fabrication technology must improve s...
DAC
2005
ACM
14 years 5 months ago
2005
ACM
Device and interconnect fabrics at the nanoscale will have a density of defects and susceptibility to transient faults far exceeding those of current silicon technologies. In this...
DSN
2007
IEEE
13 years 11 months ago
2007
IEEE
A new approach is proposed that exploits repetition inherent in programs to provide low-overhead transient fault protection in a processor. Programs repeatedly execute the same in...
PRDC
2006
IEEE
13 years 10 months ago
2006
IEEE
As SRAM devices are scaled down, the number of variation-induced defective memory cells increases rapidly. Combination of ECC, particularly SECDED, with a redundancy technique can...