13 search results - page 2 / 3 » Exploiting STI stress for performance |
TPDS
2008
13 years 5 months ago
2008
: The STI CELL processor introduces pioneering solutions in processor architecture. At the same time it presents new challenges for the development of numerical algorithms. One is ...
IJIT
2004
13 years 6 months ago
2004
Corrosion causes many failures in chemical process installations. These failures generate high costs, therefore an effective corrosion monitoring system obtrudes. This paper focuse...
ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
DATE
2004
IEEE
13 years 9 months ago
2004
IEEE
When an application or external environmental conditions cause a chip's cooling capacity to be exceeded, dynamic thermal management (DTM) dynamically reduces the power densit...
JMM2
2008
13 years 5 months ago
2008
: As computer performance and graphics hardware continue to improve, the gamer is increasingly being presented with richer and more realistic visual environments. Viewing these vir...